Services
Below is a list of some of the services we offer. For our complete range please give us a call and one of our process integration engineers will be glad to help you.
Lithography
- Contact printing, single and double sided. min resolution of 2um
- Stepper Lithography, min resolution 480nm
- Direct write (E-Beam), min resolution down to 20nm
- Robotic wafer handling for optimum yield
- Spray coating technology for high topology surfaces
Nano Imprinting Technology
- Nano stamping and patterning down to 50nm resolution
Dry etching
- RIE
- DRIE, Advanced Silicon Etch using Bosch process
- Ion Beam Milling
Implantation
- upto 750keV with an extensive range of targets
Growth, diffusion and wet processing
- Extensive range of furnaces from standard anneal to high quality gate oxides
- Full wet processing line
Deposition
- Sputtering and Electron beam evaporation with various targets
- PECVD Silicon nitride, silicon oxide and TEOS
- Low Pressure CVD silicon nitride and poly/amorphous silicon reactors
Metrology and Inspection
- Ellipsometery, Nano-Spec, SEM and microscopy inspection
Measurement tools
- Stress, dektak and four point probe measurement tools
Dicing and bonding
- Wafer sawing/dicing, gold wire bonding and packaging
Miscellaneous
- Electrophoretic coating for extreme MEMS technology